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! Caution
Continued from the preceding page.
4-2. Flow Soldering
C02E.pdf
Sep.25,2013
1. Do not apply flow soldering to chips not listed in table 2.
[Standard Conditions for Flow Soldering]
Table 2
Temperature ( D )
Soldering
Soldering
Part Number
GR3/GRM Series 18/21/31 sizes
Temperature Differential
Peak
Temperature
Δ T
Gradual
Cooling
GQM Series 18/21 sizes
Preheating
LLL Series 21/31 sizes
GRJ Series Rated Voltage 250VDC
Δ T V 150°C
Peak
Temperature
or more 18/21/31 sizes
2. When sudden heat is applied to the components, the
Preheating
Time
mechanical strength of the components will decrease
30-90 seconds
5 seconds max.
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required
to keep the temperature differential between the solder
and the components surface ( Δ T) as low as possible.
3. Excessively long soldering time or high soldering
[Allowable Flow Soldering Temperature and Time]
280
270
260
250
240
230
temperature can result in leaching of the outer electrodes,
220
0
10
20
30 40
causing poor adhesion or a reduction in capacitance
value due to loss of contact between the electrodes and
end termination.
4. When components are immersed in solvent after
mounting, be sure to maintain the temperature differential
( Δ T) between the component and solvent within the range
shown in the table 2.
Recommended Conditions
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Pb-Sn Solder
Lead Free Solder
Preheating Peak Temperature
Soldering Peak Temperature
Atmosphere
90 to 110°C
240 to 250°C
Air
100 to 120°C
250 to 260°C
N 2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during board
Up to Chip Thickness
bending or any other stressful condition.
Adhesive
in section
Continued on the following page.
146
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GRM43DR61E106MA12L
制造商:Murata Manufacturing Co Ltd 功能描述: 制造商:Murata Manufacturing Co Ltd 功能描述:CAP,CERAMIC CHIP,10UF,25VDC,20%,SMD,1812-CASE
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